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Chip manufacturing process
Release time:
Aug 02,2022
The first is chip design. According to the needs of the design, the generated "pattern"
1. The raw material wafer of the chip
The composition of the wafer is silicon, the silicon is refined from quartz sand, and the wafer is purified by silicon element (99.999%), and then these pure silicon are made into silicon crystal rods, which become the quartz semiconductors for the manufacture of integrated circuits. The material, which is sliced, is the wafer that is specifically required for chip fabrication. The thinner the wafer, the lower the production cost, but the higher the process requirements.
2. Wafer coating
Wafer coating can resist oxidation and temperature resistance, and its material is a kind of photoresist.
3. Wafer lithography development and etching
The process uses chemicals that are sensitive to UV light, which softens when exposed to UV light. The shape of the chip can be obtained by controlling the position of the shade. A photoresist is applied to the silicon wafer so that it dissolves when exposed to UV light. At this time, the first part of the shade can be used, so that the part that is directly exposed to the ultraviolet light is dissolved, and the dissolved part can then be washed away with a solvent. The rest is the same shape as the shade, and this effect is exactly what we want. This gives the silicon dioxide layer we need.
4. Doping with impurities
Implant ions into the wafer to generate corresponding P and N semiconductors.
The specific process is to start from the exposed area on the silicon wafer and put it into the chemical ion mixture. This process changes the way the doped regions conduct electricity, allowing each transistor to switch on, off, or carry data. Simple chips can use only one layer, but complex chips usually have many layers. At this time, the process is repeated continuously, and different layers can be connected by opening windows. This is similar to the production principle of multi-layer PCB boards. More complex chips may require multiple layers of silicon dioxide, which are achieved by repeating photolithography and the above process to form a three-dimensional structure.
5. Wafer test
After the above several processes, lattice-shaped grains are formed on the wafer. The electrical characteristics of each die are tested by needle testing. Generally, each chip has a huge number of dies, and it is a very complicated process to organize a needle test mode, which requires mass production of models with the same chip specification structure as much as possible during production. The larger the quantity, the lower the relative cost, which is also a factor why the mainstream chip device cost is low.
6. Packaging
Fix the manufactured wafer, bind the pins, and make various packaging forms according to the needs. This is why the same chip core can have different packaging forms. For example: DIP, QFP, PLCC, QFN, etc. This is mainly determined by the user's application habits, application environment, market form and other peripheral factors.
7. Testing and packaging
After the above process flow, the chip production has been completed. This step is to test the chips, remove defective products, and package them.
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